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8 Layer ENIG FR4 Via-In-Pad PCB

8 Layer ENIG FR4 Via-In-Pad PCB

Kufotokozera Kwachidule:

Zigawo: 8

Kumaliza pamwamba: ENIG

Zida zoyambira: FR4

Wosanjikiza Wakunja W/S: 4.5/3.5mil

Mkati wosanjikiza W/S: 4.5/3.5mil

makulidwe: 1.2 mm

Min.dzenje awiri: 0.15mm

Njira yapadera: kudzera pa-pad


Tsatanetsatane wa Zamalonda

Chovuta kwambiri kuwongolera dzenje la pulagi mu via-mu-pad ndi mpira wa solder kapena pad pa inki mu dzenje.Chifukwa cha kufunikira kogwiritsa ntchito kachulukidwe kakang'ono ka BGA (gulu lamagulu a mpira) komanso kachipangizo kakang'ono ka SMD chip, kugwiritsa ntchito ukadaulo wa thireyi kumachulukirachulukira.Kupyolera mu njira yodalirika yodzaza mabowo, ukadaulo wa ma plate hole utha kugwiritsidwa ntchito pakupanga ndi kupanga ma board a multilayer apamwamba kwambiri, ndikupewa kuwotcherera kwachilendo.Ma Circuits a HUIHE akhala akugwiritsa ntchito ukadaulo wa pa-pad kwa zaka zambiri, ndipo ali ndi njira yabwino komanso yodalirika yopanga.

Magawo a Via-In-Pad PCB

 

Mankhwala ochiritsira

Zogulitsa zapadera

Zogulitsa zapadera

Muyezo wodzaza mabowo

IPC 4761 Mtundu VII

IPC 4761 Mtundu VII

-

Min Hole Diameter

200µm

150µm

100µm

Kuchepa kwapadi

400µm

350µm

300µm

Max Hole Diameter

500µm

400µm

-

Kukula kwapadi

700µm

600µm

-

Pini yocheperako

600µm

550µm

500µm

Aspect Ration: Ochiritsira kudzera

1:12

1:12

1:10

Mbali Ratio: Wakhungu kudzera

1:1

1:1

1:1

Ntchito Ya Plug Hole

1.Letsani malata kuti asadutse pabowo la conduction kudzera pagawo lapamwamba panthawi ya soldering yoweyula

2.Pewani zotsalira zotuluka mu dzenje

3.Letsani mipira ya malata kuti isatuluke panthawi ya soldering yoweyula, zomwe zimapangitsa kuti pakhale nthawi yochepa

4.Letsani phala la solder kuti lisalowe mu dzenje, zomwe zimapangitsa kuwotcherera komanso kukhudza koyenera.

Ubwino Wa Via-In-Pad PCB

1.Kupititsa patsogolo kutentha kwa kutentha

2.The voteji kupirira mphamvu ya vias ndi bwino

3.Kupereka malo ophwanyika komanso osasinthasintha

4.Lower parasitic inductance

Ubwino Wathu

1. Fakitale yake, malo a fakitale 12000 square metres, fakitale yogulitsa mwachindunji

2. Gulu lazamalonda limapereka ntchito zogulitsiratu komanso zotsatsa pambuyo pake

3.Process-based processing of PCB data design data kuonetsetsa kuti makasitomala angathe kubwereza ndi kutsimikizira nthawi yoyamba


  • Zam'mbuyo:
  • Ena:

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