6 Layer FR4 ENIG Impedance Control PCB

Pad: ndiye gawo lofunikira la msonkhano wokwera pamwamba, womwe umagwiritsidwa ntchito popanga mawonekedwe a board board, ndiko kuti, mitundu yosiyanasiyana ya mapepala opangidwira mitundu yapadera yamagulu.

Kupyolera mu dzenje: kudzera mu dzenje amatchedwanso metallization hole.Pagawo lawiri ndi PCB yamitundu yambiri, dzenje wamba amabowoleredwa pamphambano ya mawaya omwe amayenera kulumikizidwa pakati pa zigawo kuti alumikizane ndi mawaya osindikizidwa pakati pa zigawo.Zigawo zazikulu za dzenje ndi zakunja kwa dzenje ndi kukula kwa dzenje.

Bowo lokha limakhala ndi mphamvu ya parasitic ndi inductance pansi, zomwe nthawi zambiri zimabweretsa zotsatira zoyipa pamapangidwe ozungulira.

Pad: Pamene mawonekedwe a pad sanapangidwe molondola, zimakhala zovuta kuti afike kumalo omwe amafunidwa.Itha kugwiritsidwa ntchito pazida zokwera pamwamba kapena zida zamapulagi.

Kupyolera mu dzenje: Pa bolodi lozungulira, mzere umadumpha kuchokera mbali imodzi ya bolodi kupita mbali ina.Bowo lomwe limalumikiza mawaya awiriwa limatchedwanso dzenje (mosiyana ndi pad, palibe wosanjikiza wa solder pambali).Amatchedwanso metallization dzenje, mu gulu iwiri ndi multilayer PCB, polumikiza kusindikizidwa waya pakati pa zigawo, mu wosanjikiza aliyense ayenera kugwirizana pa mphambano ya pobowola waya pa dzenje anthu, ndiye kudzera dzenje.

Mwaukadaulo, wosanjikiza zitsulo ndi PCB pa cylindrical pamwamba pa dzenje khoma la dzenje kudzera mankhwala mafunsidwe njira kulumikiza zojambula zamkuwa zomwe zimafunika kulumikizidwa pakati wosanjikiza, ndi chapamwamba ndi m'munsi mbali za dzenje kudzera mu mawonekedwe a zozungulira solder pad, magawo a dzenje makamaka zikuphatikizapo awiri akunja dzenje ndi kukula kwa dzenje.

Kupyolera mu dzenje: dzenje pa PCB, kusewera udindo conduction kapena kutentha dissipation.

Pad: ndi mbale yamkuwa ya PCB, ena amagwirizana ndi dzenje kuti alumikizane, ndi mbale ina yayikulu, yomwe imagwiritsidwa ntchito kwambiri kuyika magawo.